EMK107BBJ225KK-T [TAIYO YUDEN]
CAP CER 2.2UF 16V X5R 0603;型号: | EMK107BBJ225KK-T |
厂家: | TAIYO YUDEN (U.S.A.), INC |
描述: | CAP CER 2.2UF 16V X5R 0603 |
文件: | 总22页 (文件大小:552K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
(4) Power generation control equipment (nuclear power,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Product information in this catalog is as of January2021.Allofthe
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
Approval of Product Specifications
■
Please contact TAIYO YUDEN for further details of product
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
4. Limitation of Liability
■
■
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for general-
purpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
Safety Design
■
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
Intellectual Property Rights
■
■
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) Highly public information network equipment, data-
processing equipment (telephone exchange, and base
station, etc.)
TAIYO YUDEN’s Official Sales Channel
■
■
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’s official sales channel.
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Caution for Export
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
for General Electronic Equipment
MULTILAYER CERAMIC CAPACITORS
WAVE REFLOW
■PARTS NUMBER
△=Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
-
⑩
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑪
①Rated voltage
③End termination
Code
P
Rated voltage[VDC]
Code
End termination
Plated
2.5
4
K
S
A
Cu Internal Electrodes (For High Frequency)
J
6.3
10
④Dimension(L×W)
Type
L
Dimensions
EIA(inch)
E
16
(L×W)[mm]
T
25
021
042
063
0.25× 0.125
0.4 × 0.2
008004
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
G
U
35
50
0.6 × 0.3
H
100
250
630
2000
1.0 × 0.5
Q
S
105
107
212
0.52× 1.0 ※
1.6 × 0.8
X
0.8 × 1.6 ※
2.0 × 1.25
1.25× 2.0 ※
3.2 × 1.6
②Series name
Code
M
Series name
316
325
432
Multilayer ceramic capacitor
3.2 × 2.5
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
4.5 × 3.2
W
Note : ※LW reverse type(□WK) only
⑤Dimension tolerance
Code
△
Type
ALL
063
105
107
L[mm]
W[mm]
T[mm]
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
0.5±0.10
1.6+0.15/-0.05
0.8+0.15/-0.05
0.8+0.15/-0.05
0.45±0.05
A
212
2.0+0.15/-0.05
1.25+0.15/-0.05
1.6±0.20
0.85±0.10
1.25+0.15/-0.05
0.85±0.10
316
3.2±0.20
1.6±0.20
325
063
105
3.2±0.30
2.5±0.30
2.5±0.30
0.6±0.09
0.3±0.09
0.3±0.09
1.0+0.15/-0.05
0.5+0.15/-0.05
0.5+0.15/-0.05
0.45±0.05
107
1.6+0.20/-0
0.8+0.20/-0
0.8+0.20/-0
0.45±0.05
B
212
2.0+0.20/-0
1.25+0.20/-0
0.85±0.10
1.25+0.20/-0
1.6±0.30
316
105
063
105
3.2±0.30
1.6±0.30
C
E
1.0+0.20/-0
0.6 + 0.25/- 0
1.0+0.30/-0
0.5+0.20/-0
0.3 + 0.25/- 0
0.5+0.30/-0
0.5+0.20/-0
0.3 + 0.25/ - 0
0.5+0.30/-0
Note: cf. STANDARD EXTERNAL DIMENSIONS
△= Blank space
⑥Temperature characteristics code
■High dielectric type(Excluding Super low distortion multilayer ceramic capacitor)
Applicable
standard
Temperature
range[℃]
Capacitance
tolerance
±10%
±20%
±10%
±20%
±10%
±20%
±10%
±20%
±10%
±20%
±10%
Tolerance
Code
Ref. Temp.[℃]
Capacitance change
±10%
code
K
JIS
B
-25~+ 85
-55~+ 85
-55~+125
-55~+105
-55~+125
-55~+ 85
20
25
25
25
25
M
K
BJ
EIA
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
X5R
±15%
M
K
B7
C6
±15%
M
K
±22%
M
K
C7
±22%
M
K
LD(※)
25
±15%
M
±20%
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△= Blank space
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
4
for General Electronic Equipment
■Temperature compensating type
Applicable
Temperature
range[℃]
Capacitance
tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±5%
Tolerance
Code
Ref. Temp.[℃]
Capacitance change
standard
code
A
B
CG
EIA
C0G
-55~+125
25
0±30ppm/℃
C
D
J
±0.25pF
±0.5pF
±5%
C
JIS
UJ
20
UJ
UK
-55~+125
-750±120ppm/℃
-750±250ppm/℃
D
EIA
JIS
EIA
U2J
UK
25
20
25
J
-55~+125
-55~+125
±0.25pF
C
U2K
⑥Series code
⑨Thickness
・Super low distortion multilayer ceramic capacitor
Code
K
Thickness[mm]
Code
SD
Series code
Standard
0.125
0.13
0.18
H
E
・Medium-High Voltage Multilayer Ceramic Capacitor
C
D
P
0.2
Code
SD
Series code
Standard
0.3
0.45(107type or more)
0.5
T
⑦Nominal capacitance
K
Code
V
Nominal capacitance
(example)
W
A
0R5
0.5pF
1pF
0.8
010
D
F
0.85(212type or more)
100
10pF
1.15
1.25
1.6
101
100pF
1,000pF
10,000pF
G
L
102
103
N
1.9
104
0.1
1.0
μ
F
F
F
Y
2.0 max
2.5
105
μ
M
106
10
μ
107
100
μF
⑩Special code
Note : R=Decimal point
Code
-
Special code
Standard
⑧Capacitance tolerance
Code
A
Capacitance tolerance
±0.05pF
±0.1pF
⑪Packaging
Code
Packaging
B
F
T
φ178mm Taping (2mm pitch)
φ178mm Taping (4mm pitch)
C
±0.25pF
±0.5pF
D
φ178mm Taping (4mm pitch, 1000 pcs/reel)
325 type(Thickness code M)
P
F
±1pF
G
±2%
φ178mm Taping (2mm pitch)105type only
(Thickness code E,H)
R
J
±5%
K
±10%
W
φ178mm Taping(1mm pitch)021/042type only
M
Z
±20%
+80/-20%
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
5
for General Electronic Equipment
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm]
T
W
Type( EIA )
L
W
*1
K
K
C
D
C
P
T
H
E
e
L
□MK021(008004)
0.25±0.013
0.25±0.013
0.125±0.013
0.125±0.013
0.125±0.013
0.125±0.013
0.0675±0.0275
0.0675±0.0275
□VS021(008004)
T
□MK042(01005)
e
□VS042(01005)
0.4±0.02
0.4±0.02
0.6±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.1±0.03
0.1±0.03
0.15±0.05
□MK063(0201)
0.13±0.02
0.18±0.02
0.2±0.02
L
□MK105(0402)
1.0±0.05
0.5±0.05
C
P
V
W
P
K
A
V
K
D
G
D
D
F
0.25±0.10
W
0.3±0.03
0.5±0.05
□VK105(0402)
1.0±0.05
0.5±0.05
1.0±0.05
0.5±0.05
0.25±0.10
0.18±0.08
□WK105(0204)※
0.52±0.05
0.3±0.05
0.45±0.05
0.8±0.10
T
□MK107(0603)
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
0.35±0.25
0.25±0.15
□WK107(0306)※
0.5±0.05
e
0.45±0.05
0.85±0.10
1.25±0.10
0.85±0.10
0.85±0.10
1.15±0.10
1.6±0.20
□MK212(0805)
□WK212(0508)※
□MK316(1206)
2.0±0.10
1.25±0.15
3.2±0.15
1.25±0.10
2.0±0.15
1.6±0.15
0.5±0.25
0.3±0.2
※ LW reverse type
0.5+0.35/-0.25
L
0.85±0.10
1.15±0.10
1.9±0.20
D
F
□MK325(1210)
□MK432(1812)
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
N
Y
M
Y
M
0.6±0.3
1.9+0.1/-0.2
2.5±0.20
2.0+0/-0.30
2.5±0.20
0.6±0.4
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity[pcs]
Type
021
EIA(inch)
[mm]
0.125
Code
K
Paper tape
-
Embossed tape
50000
008004
01005
C
D
P
042
0.2
0.3
-
40000
-
063
105
0201
15000
T
0.13
0.18
0.2
H
E
-
20000
15000
-
-
C
P
20000
15000
0402
0.3
-
V
W
P
0.5
10000
-
0204 ※
0603
0.30
0.45
0.8
K
4000
-
-
4000
-
107
212
316
A
V
K
0306 ※
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.6
4000
0805
D
G
D
D
F
-
4000
4000
-
3000
-
0508 ※
1206
-
3000
2000
L
-
0.85
1.15
1.9
D
F
-
2000
325
432
1210
1812
N
Y
2.0 max
2.5
M
Y
-
-
-
1000
1000
500
2.0 max
2.5
M
Note : ※.LW Reverse type(□WK)
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
6
for General Electronic Equipment
■PARTS NUMBER
Medium-High Voltage Multilayer Ceramic Capacitors
●105TYPE
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ0.5mm thickness(V)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK105 B7221[]V-F
HMK105 B7331[]V-F
HMK105 B7471[]V-F
HMK105 B7681[]V-F
HMK105 B7102[]V-F
HMK105 B7152[]V-F
HMK105 B7222[]V-F
HMK105 B7332[]V-F
HMK105 B7472[]V-F
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
220 p
330 p
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
470 p
680 p
100
1000 p
1500 p
2200 p
3300 p
4700 p
【Temperature Characteristic CG : CG/C0G(-55~+125℃)】ꢀ0.5mm thickness(V)
Q
(at 1MHz)
min
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Thickness*3 [mm]
Part number 1
Part number 2
Capacitance tolerance
Rated voltage x %
HMK105 CG080DV-F
HMK105 CG090DV-F
HMK105 CG100DV-F
HMK105 CG120JV-F
HMK105 CG150JV-F
HMK105 CG180JV-F
HMK105 CG220JV-F
HMK105 CG240JV-F
HMK105 CG270JV-F
HMK105 CG330JV-F
HMK105 CG390JV-F
HMK105 CG470JV-F
HMK105 CG560JV-F
HMK105 CG680JV-F
HMK105 CG820JV-F
HMK105 CG101JV-F
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
8 p
9 p
±0.5pF
±0.5pF
±0.5pF
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
560
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
580
10 p
12 p
15 p
18 p
22 p
24 p
27 p
33 p
39 p
47 p
56 p
68 p
82 p
100 p
600
640
700
760
840
880
100
940
1000
1000
1000
1000
1000
1000
1000
●107TYPE
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ0.8mm thickness(A)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
HMK107 BJ102[]A-T
HMK107 BJ152[]A-T
HMK107 BJ222[]A-T
HMK107 BJ332[]A-T
HMK107 BJ472[]A-T
HMK107 BJ682[]A-T
HMK107 BJ103[]A-T
HMK107 BJ153[]A-T
HMK107 BJ223[]A-T
HMK107 BJ333[]A-T
HMK107 BJ473[]A-T
HMK107 BJ104[]A-T
HMK107 BJ224[]A-TE
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
200
200
150
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
0.22 μ
【Temperature Characteristic C7 : X7S(-55~+125℃)】ꢀ0.8mm thickness(A)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
0.8±0.10
Part number 1
Part number 2
Rated voltage x %
150
HMK107 C7224[]A-TE
100
X7S
0.22 μ
±10, ±20
3.5
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ0.8mm thickness(A)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK107 B7102[]A-T
HMK107 B7152[]A-T
HMK107 B7222[]A-T
HMK107 B7332[]A-T
HMK107 B7472[]A-T
HMK107 B7682[]A-T
HMK107 B7103[]A-T
HMK107 B7153[]A-T
HMK107 B7223[]A-T
HMK107 B7333[]A-T
HMK107 B7473[]A-T
HMK107 B7104[]A-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
R
100
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
27
for General Electronic Equipment
■PARTS NUMBER
【Temperature Characteristic SD : Standard(-55~+125℃)】ꢀ0.8mm thickness(A)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK107 SD101KA-T
HMK107 SD121KA-T
HMK107 SD151KA-T
HMK107 SD181KA-T
HMK107 SD221KA-T
HMK107 SD271KA-T
HMK107 SD331KA-T
HMK107 SD391KA-T
HMK107 SD471KA-T
HMK107 SD561KA-T
HMK107 SD681KA-T
HMK107 SD821KA-T
HMK107 SD102KA-T
100 p
120 p
150 p
180 p
220 p
270 p
330 p
390 p
470 p
560 p
680 p
820 p
1000 p
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
200
200
200
200
200
200
200
200
200
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
100
Standard Type
●212TYPE
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ1.25mm thickness(G)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
HMK212 BJ103[]G-T
HMK212 BJ153[]G-T
HMK212 BJ223[]G-T
HMK212 BJ333[]G-T
HMK212 BJ473[]G-T
HMK212 BJ683[]G-T
HMK212 BJ104[]G-T
HMK212 BJ224[]G-T
HMK212 BJ474[]G-TE
HMK212BBJ105[]G-TE
QMK212 BJ472[]G-T
QMK212 BJ682[]G-T
QMK212 BJ103[]G-T
QMK212 BJ153[]G-T
QMK212 BJ223[]G-T
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.068 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25+0.20/-0
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
0.22 μ
0.47 μ
1 μ
X5R*1
B
X5R*1
B
X5R*1
B
4700 p
X5R*1
B
6800 p
X5R*1
B
250
0.01 μ
0.015 μ
0.022 μ
X5R*1
B
X5R*1
B
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ0.85mm thickness(D)
Soldering
R:Reflow
W:Wave
R
R
R
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
QMK212 BJ102[]D-T
QMK212 BJ152[]D-T
QMK212 BJ222[]D-T
QMK212 BJ332[]D-T
1000 p
1500 p
2200 p
3300 p
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
X5R*1
B
250
X5R*1
B
X5R*1
B
【Temperature Characteristic C7 : X7S(-55~+125℃)】ꢀ1.25mm thickness(G)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK212 C7474[]G-TE
HMK212BC7105[]G-TE
100
100
X7S
X7S
0.47 μ
1 μ
±10, ±20
±10, ±20
3.5
3.5
150
150
1.25±0.10
1.25+0.20/-0
R
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ1.25mm thickness(G)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK212 B7103[]G-T
HMK212 B7153[]G-T
HMK212 B7223[]G-T
HMK212 B7333[]G-T
HMK212 B7473[]G-T
HMK212 B7683[]G-T
HMK212 B7104[]G-T
HMK212 B7224[]G-T
QMK212 B7472[]G-T
QMK212 B7682[]G-T
QMK212 B7103[]G-T
QMK212 B7153[]G-T
QMK212 B7223[]G-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.01 μ
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.068 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
100
250
0.22 μ
4700 p
6800 p
0.01 μ
0.015 μ
0.022 μ
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ0.85mm thickness(D)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
QMK212 B7102[]D-T
QMK212 B7152[]D-T
QMK212 B7222[]D-T
QMK212 B7332[]D-T
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
250
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
28
for General Electronic Equipment
■PARTS NUMBER
【Temperature Characteristic SD : Standard(-55~+125℃)】ꢀ0.85mm thickness(D)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK212 SD222KD-T
HMK212 SD472KD-T
QMK212 SD101KD-T
QMK212 SD121KD-T
QMK212 SD151KD-T
QMK212 SD181KD-T
QMK212 SD221KD-T
QMK212 SD331KD-T
QMK212 SD391KD-T
QMK212 SD471KD-T
QMK212 SD561KD-T
QMK212 SD681KD-T
QMK212 SD821KD-T
QMK212 SD102KD-T
2200 p
4700 p
100 p
120 p
150 p
180 p
220 p
330 p
390 p
470 p
560 p
680 p
820 p
1000 p
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
200
200
150
150
150
150
150
150
150
150
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
100
Standard Type
250
【Temperature Characteristic SD : Standard(-55~+125℃)】ꢀ1.25mm thickness(G)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
1.25±0.10
Part number 1
Part number 2
Rated voltage x %
200
Standard Type
HMK212 SD392KG-T
100
3900 p
±10
0.1
●316TYPE
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ1.6mm thickness(L)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
HMK316 BJ473[]L-T
HMK316 BJ683[]L-T
HMK316 BJ104[]L-T
HMK316 BJ154[]L-T
HMK316 BJ224[]L-T
HMK316 BJ334[]L-T
HMK316 BJ474[]L-T
HMK316 BJ105[]L-T
HMK316ABJ225[]L-TE
QMK316 BJ333[]L-T
QMK316 BJ473[]L-T
QMK316 BJ683[]L-T
QMK316 BJ104[]L-T
SMK316 BJ153[]L-T
SMK316 BJ223[]L-T
0.047 μ
0.068 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
2.2 μ
X5R*1
B
0.033 μ
0.047 μ
0.068 μ
0.1 μ
X5R*1
B
250
630
X5R*1
B
X5R*1
B
X5R*1
B
0.015 μ
0.022 μ
X5R*1
B
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ1.15mm thickness(F)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
SMK316 BJ102[]F-T
SMK316 BJ152[]F-T
SMK316 BJ222[]F-T
SMK316 BJ332[]F-T
SMK316 BJ472[]F-T
SMK316 BJ682[]F-T
SMK316 BJ103[]F-T
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
630
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic C7 : X7S(-55~+125℃)】ꢀ1.6mm thickness(L)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
1.6±0.20
Part number 1
Part number 2
Rated voltage x %
150
HMK316AC7225[]L-TE
100
X7S
2.2 μ
±10, ±20
3.5
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ1.6mm thickness(L)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK316 B7473[]L-T
HMK316 B7683[]L-T
HMK316 B7104[]L-T
HMK316 B7154[]L-T
HMK316 B7224[]L-T
HMK316 B7334[]L-T
HMK316 B7474[]L-T
HMK316 B7105[]L-T
QMK316 B7333[]L-T
QMK316 B7473[]L-T
QMK316 B7683[]L-T
QMK316 B7104[]L-T
SMK316 B7153[]L-T
SMK316 B7223[]L-T
SMK316AB7333[]L-T
SMK316AB7473[]L-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.047 μ
0.068 μ
0.1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
120
120
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
100
0.033 μ
0.047 μ
0.068 μ
0.1 μ
250
630
0.015 μ
0.022 μ
0.033 μ
0.047 μ
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
29
for General Electronic Equipment
■PARTS NUMBER
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ1.15mm thickness(F)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
SMK316 B7102[]F-T
SMK316 B7152[]F-T
SMK316 B7222[]F-T
SMK316 B7332[]F-T
SMK316 B7472[]F-T
SMK316 B7682[]F-T
SMK316 B7103[]F-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
0.01 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
R
R
630
【Temperature Characteristic SD : Standard(-55~+125℃)】ꢀ1.6mm thickness(L)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK316 SD223KL-T
QMK316 SD103KL-T
100
250
0.022 μ
0.01 μ
±10
±10
0.1
0.1
200
150
1.6±0.20
1.6±0.20
Standard Type
R
●325TYPE
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ2.5mm thickness(M)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
X5R*1
B
HMK325 BJ225[]M-P
HMK325 BJ475[]M-PE
100
100
2.2 μ
4.7 μ
±10, ±20
±10, ±20
3.5
3.5
200
150
2.5±0.20
2.5±0.20
R
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ1.9mm thickness(N)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
HMK325 BJ154[]N-T
HMK325 BJ224[]N-T
HMK325 BJ334[]N-T
HMK325 BJ474[]N-T
HMK325 BJ684[]N-T
HMK325 BJ105[]N-T
HMK325 BJ475[]N-TE
QMK325 BJ473[]N-T
QMK325 BJ104[]N-T
QMK325 BJ154[]N-T
QMK325 BJ224[]N-T
SMK325 BJ223[]N-T
SMK325 BJ333[]N-T
SMK325 BJ473[]N-T
0.15 μ
0.22 μ
0.33 μ
0.47 μ
0.68 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
150
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
4.7 μ
X5R*1
B
0.047 μ
0.1 μ
X5R*1
B
250
630
X5R*1
B
0.15 μ
0.22 μ
0.022 μ
0.033 μ
0.047 μ
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】ꢀ1.15mm thickness(F)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
1.15±0.10
Part number 1
Part number 2
Rated voltage x %
200
X5R*1
B
HMK325 BJ104[]F-T
100
0.1 μ
±10, ±20
3.5
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ2.5mm thickness(M)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
2.5±0.20
Part number 1
Part number 2
Rated voltage x %
200
HMK325 B7225[]M-P
100
X7R
2.2 μ
±10, ±20
3.5
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ1.9mm thickness(N)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK325 B7154[]N-T
HMK325 B7224[]N-T
HMK325 B7334[]N-T
HMK325 B7474[]N-T
HMK325 B7684[]N-T
HMK325 B7105[]N-T
QMK325 B7473[]N-T
QMK325 B7104[]N-T
QMK325 B7154[]N-T
QMK325 B7224[]N-T
SMK325 B7223[]N-T
SMK325 B7333[]N-T
SMK325 B7473[]N-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.15 μ
0.22 μ
0.33 μ
0.47 μ
0.68 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
100
0.047 μ
0.1 μ
250
630
0.15 μ
0.22 μ
0.022 μ
0.033 μ
0.047 μ
【Temperature Characteristic C7 : X7S(-55~+125℃)】ꢀ2.5mm thickness(M)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
2.5±0.20
Part number 1
Part number 2
Rated voltage x %
150
HMK325 C7475[]M-PE
100
X7S
4.7 μ
±10, ±20
3.5
【Temperature Characteristic C7 : X7S(-55~+125℃)】ꢀ1.9mm thickness(N)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
1.9±0.20
Part number 1
Part number 2
Rated voltage x %
150
HMK325 C7475[]N-TE
100
X7S
4.7 μ
±10, ±20
3.5
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
30
for General Electronic Equipment
■PARTS NUMBER
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ1.15mm thickness(F)
Soldering
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
1.15±0.10
Part number 1
Part number 2
R:Reflow
W:Wave
R
Rated voltage x %
200
HMK325 B7104[]F-T
100
X7R
0.1 μ
±10, ±20
3.5
●432TYPE
【Temperature Characteristic BJ : B(-25~+85℃)/X5R(-55~+85℃)】 2.5mm thickness(M)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
X5R*1
B
HMK432 BJ474[]M-T
HMK432 BJ105[]M-T
HMK432 BJ155[]M-T
HMK432 BJ225[]M-T
QMK432 BJ104[]M-T
QMK432 BJ224[]M-T
QMK432 BJ334[]M-T
QMK432 BJ474[]M-T
SMK432 BJ473[]M-T
SMK432 BJ683[]M-T
SMK432 BJ104[]M-T
0.47 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
100
X5R*1
B
1.5 μ
X5R*1
B
2.2 μ
X5R*1
B
0.1 μ
X5R*1
B
0.22 μ
0.33 μ
0.47 μ
0.047 μ
0.068 μ
0.1 μ
250
630
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic B7 : X7R(-55~+125℃)】 2.5mm thickness(M)
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
HMK432 B7474[]M-T
HMK432 B7105[]M-T
HMK432 B7155[]M-T
HMK432 B7225[]M-T
QMK432 B7104[]M-T
QMK432 B7224[]M-T
QMK432 B7334[]M-T
QMK432 B7474[]M-T
SMK432 B7473[]M-T
SMK432 B7683[]M-T
SMK432 B7104[]M-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.47 μ
1 μ
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
R
R
R
100
1.5 μ
2.2 μ
0.1 μ
0.22 μ
0.33 μ
0.47 μ
0.047 μ
0.068 μ
0.1 μ
250
630
【Temperature Characteristic B7 : X7R(-55~+125℃)】ꢀ2.0mm thickness(Y)
Soldering
R:Reflow
W:Wave
R
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x %
XMK432 B7222KY-TE
XMK432 B7472KY-TE
2000
2000
X7R
X7R
2200 p
4700 p
±10
±10
2.5
2.5
110
110
2.0+0/-0.30
2.0+0/-0.30
R
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
31
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
code
K
Paper tape
Embossed tape
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
0.125
-
-
50000
0.2
0.2
C, D
C
P,T
P
40000
0.3
15000
10000
-
-
-
□WK105(0204) ※
0.3
0.13
0.18
0.2
H
E
20000
15000
-
-
□MK105(0402)
□MF105(0402)
C
P
20000
15000
10000
10000
4000
-
0.3
-
0.5
V
W
K
-
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
0.5
-
0.45
0.5
-
V
A
C
A
K
4000
-
0.8
4000
4000
3000
0.7
-
0.8
3000
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
□MK212(0805)
4000
-
□WK212(0508)
□MF212(0805)
※
D
G
D
D
G
D
F
-
4000
4000
-
3000
-
□VS212(0805)
□MJ212(0805)
-
2000
-
4000
-
□MK316(1206)
□MF316(1206)
3000
2000
3000
2000
L
-
1.15
1.6
F
-
□MJ316(1206)
L
-
0.85
1.15
1.9
D
F
-
2000
□MK325(1210)
□MF325(1210)
N
Y
2.0max.
2.5
M
N
M
M
-
-
-
-
1000
2000
1.9
□MJ325(1210)
□MK432(1812)
2.5
500(T), 1000(P)
500
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape(8mm wide)
●Pressed carrier tape( 2mm pitch)
Unit:mm(inch)
T
1.75±0.1
φ1.5+0.1/-0
(0.069±0.004)
(φ0.059+0.004/-0)
Sprocket hole
A
B
T1
2.0±0.05
4.0±0.1
F
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
A
B
F
T
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) (*1 C)
□MK105(0402) (*1 P)
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit:mm
0.45max.
Note *1 Thickness, C:0.2mm ,P:0.3mm. ※ LW Reverse type.
●Punched carrier tape (2mm pitch)
Unit:mm(inch)
1.75±0.1
φ1.5+0.1/-0
(0.069±0.004)
(φ0.059+0.004/-0)
Sprocket hole
T
A
B
F
2.0±0.05
4.0±0.1
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
F
Tape Thickness
T
Type(EIA)
A
B
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit:mm
●Punched carrier tape (4mm pitch)
φ1.5+0.1/-0
Unit:mm(inch)
T
1.75±0.1
(0.069±0.004)
(φ0.059+0.004/-0)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.1
F
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Insertion Pitch
F
Tape Thickness
T
Type(EIA)
A
B
□MK107(0603)
□WK107(0306)
□MF107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note:Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit:mm
●Embossed tape(4mm wide)
Sprocket hole
Unit:mm(inch)
0.9±0.05
φ0.8±0.04
(0.035±0.002)
(φ0.031±0.002)
A
B
F
1.0±0.02
2.0±0.04
(0.039±0.001) (0.079±0.002)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
A
B
F
K
T
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
0.135
0.27
1.0±0.02
0.5max.
0.25max.
Unit:mm
0.23
0.43
●Embossed tape(8mm wide)
Unit:mm(inch)
1.75±0.1
φ1.5+0.1/-0
(0.069±0.004)
(φ0.059+0.004/-0)
Sprocket hole
A
B
F
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
A
B
F
K
T
□MK105(0402)
0.6
1.0
1.1
1.8
2.0±0.1
0.6max
1.3max.
0.2±0.1
0.25±0.1
□WK107(0306) ※
□MK212(0805)
1.65
2.0
2.4
3.6
3.6
□MF212(0805)
4.0±0.1
□MK316(1206)
□MF316(1206)
3.4max.
0.6max.
□MK325(1210)
2.8
□MF325(1210)
Note: ※ LW Reverse type.
Unit:mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape(12mm wide)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Unit:mm(inch)
1.75±0.1
(0.069±0.004)
Sprocket hole
A
B
4.0±0.1
2.0±0.1
(0.157±0.004)
F
(0.079±0.004)
Chip Cavity
Insertion Pitch
F
Tape Thickness
Type(EIA)
A
B
K
T
□MK325(1210)
□MK432(1812)
3.1
3.7
4.0
4.9
8.0±0.1
8.0±0.1
4.0max.
4.0max.
0.6max.
0.6max.
Unit:mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
160mm or more
(3.94inches or more)
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50min.
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit:mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0~20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
Temperature Compensating(Class1)
CG
: -55 to +125℃
X7R, X7S : -55 to +125℃
Specified Value
X5R
B
: -55 to +85℃
: -25 to +85℃
: -55 to +125℃
High Permittivity (Class2)
SD
2. Storage Temperature Range
Temperature Compensating(Class1)
CG
: -55 to +125℃
X7R, X7S : -55 to +125℃
Specified Value
X5R
B
: -55 to +85℃
: -25 to +85℃
: -55 to +125℃
High Permittivity (Class2)
SD
3. Rated Voltage
Specified Value
Temperature Compensating(Class1)
High Permittivity (Class2)
100VDC(HMK)
100VDC(HMK), 250VDC(QMK), 630VDC(SMK), 2000VDC(XMK)
4. Withstanding Voltage(Between terminals)
Specified Value
No breakdown or damage
Applied voltage
Duration
: Rated voltage×2.5(HMK), Rated voltage×2(QMK), Rated voltage×1.2(SMK)(XMK)
Test Methods and
Remarks
: 1 to 5sec.
: 50mA max.
Charge/discharge current
5. Insulation Resistance
Specified Value
Temperature Compensating(Class1)
10000 MΩ min.
High Permittivity (Class2)
100MΩ・μF or 10GΩ, whichever is smaller.
Applied voltage
Duration
: Rated voltage(HMK, QMK), 500V(SMK,XMK)
Test Methods and
Remarks
: 60±5sec.
: 50mA max.
Charge/discharge current
6. Capacitance (Tolerance)
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C>10pF
: ±0.25pF
Temperature Compensating(Class1)
: ±0.5pF
Specified Value
: ±5% or ±10%
High Permittivity (Class2)
±10%, ±20%
Measuring frequency
Measuring voltage
Bias application
: 1MHz±10%
: 0.5~5Vrms
: None
Temperature Compensating(Class1)
High Permittivity (Class2)
Test Methods and
Remarks
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
7. Q or Dissipation Factor
C<30pF : Q≧400+20C
C≧30pF : Q≧1000
Temperature Compensating(Class1)
(C:Nominal capacitance)
Specified Value
High Permittivity (Class2)
3.5%max(HMK),2.5%max(QMK, SMK)
Measuring frequency
Measuring voltage
Bias application
: 1MHz±10%
Temperature Compensating(Class1)
: 0.5~5Vrms
: None
Test Methods and
Remarks
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
High Permittivity (Class2)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E09R01
8. Temperature Characteristic of Capacitance
Temperature Compensating(Class1)
CG
:0±30ppm/℃(-55 to +125℃)
B
: ±10%(-25 to +85℃)
: ±15%(-55 to +85℃)
: ±15%(-55 to +125℃
: ±22%(-55 to +125℃)
X5R
X7R
X7S
SD
Specified Value
High Permittivity (Class2)
Class 1
:
-
(-55 to +125℃)
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
(C85-C20)
×106(ppm/℃)
C20×△T
△T=65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Test Methods and
Remarks
Step
B
X5R、X7R、X6S、X7S
Minimum operating temperature
1
2
3
20℃
25℃
Maximum operating temperature
(C-C2)
C2
×100(%)
C
: Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
9. Deflection
Appearance
: No abnormality
Temperature Compensating(Class1)
High Permittivity (Class2)
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Specified Value
Appearance
: No abnormality
: Within±10%
Capacitance change
Warp
: 1mm
Duration
Test board
Thickness
: 10sec.
: Glass epoxy-resin substrate
: 1.6mm
Test Methods and
Remarks
Capacitance measurement shall be conducted with the board bent.
10. Adhesive Strength of Terminal Electrodes
Temperature Compensating(Class1)
High Permittivity (Class2)
Specified Value
No terminal separation or its indication.
Test Methods and Applied force
: 5N
Remarks
Duration
: 30±5sec.
11. Solderability
Specified Value
Temperature Compensating(Class1)
High Permittivity (Class2)
At least 95% of terminal electrode is covered by new solder
Eutectic solder
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Solder type
H60A or H63A
230±5℃
Test Methods and
Remarks
Solder temperature
Duration
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E09R01
12. Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.(HMK)
: Initial value
Temperature Compensating(Class1)
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation facto
Insulation resistance
Withstanding voltage
: Within±15%(HMK), ±10%(QMK, SMK,XMK)
: Initial value
High Permittivity (Class2)
: Initial value
(between terminals) : No abnormality
Temperature Compensating(Class1)
Preconditioning
Solder temperature
Duration
None
270±5℃
3±0.5sec.
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
24±2hrs under the standard condition Note3
Preheating conditions
Recovery
Test Methods and
Remarks
High Permittivity (Class2)
Thermal treatment(at 150℃ for 1hr) Note1
270±5℃
Preconditioning
Solder temperature
Duration
3±0.5sec.
80 to 100℃, 2 to 5 min.
Preheating conditions
Recovery
150 to 200℃, 2 to 5min.
24±2hrs under the standard condition Note3
13. Temperature Cycle (Thermal Shock)
Appearance
: No abnormality
Capacitance change
: Within ±2.5% or ±0.25pF, whichever is larger.(HMK)
: Initial value
Temperature Compensating(Class1)
Q
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation facto
Insulation resistance
Withstanding voltage
: Within±15%(HMK), ±10%(QMK, SMK ,XMK)
: Initial value
High Permittivity (Class2)
: Initial value
(between terminals) : No abnormality
Class 1
None
Class 2
Preconditioning
1 cycle
Thermal treatment (at 150℃ for 1 hr) Note 1
Step
Temperature(℃)
Time(min.)
30±3
1
2
3
4
Minimum operating temperature
Normal temperature
Test Methods and
Remarks
2 to 3
Maximum operating temperature
Normal temperature
30±3
2 to 3
Number of cycles
Recovery
5 times
6 to 24 hrs (Standard condition) Note 3
24±2 hrs (Standard condition) Note 3
14. Humidity (Steady state)
Appearance
: No abnormality
Capacitance change
Q
: Within ±5% or ±0.5pF, whichever is larger.(HMK)
: C<10pF : Q≧200+10C
Temperature Compensating(Class1)
10≦C<30pF : Q≧275+2.5C
C≧30pF:Q≧350(C:Nominal capacitance)
: 1000 MΩ min.
Specified Value
Insulation resistance
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max(HMK), 5%max(QMK, SMK, XMK).
: 25MΩμF or 1000MΩ, whichever is smaller.
High Permittivity (Class2)
Class 1
None
Class 2
Thermal treatment( at 150℃ for 1 hr) Note 1
40±2℃
Preconditioning
Temperature
Humidity
40±2℃
Test Methods and
Remarks
90 to 95%RH
500+24/-0 hrs
90 to 95%RH
Duration
500+24/-0 hrs
Recovery
6 to 24 hrs (Standard condition) Note 3
24±2 hrs (Standard condition) Note 3
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E09R01
15. Humidity Loading
Specified Value
Appearance
: No abnormality
Capacitance change
Q
: Within ±7.5% or ±0.75pF, whichever is larger (HMK).
: C<30pF:Q≧100+10C/3
Temperature Compensating(Class1)
High Permittivity (Class2)
C≧30pF:Q≧200 (C:Nominal capacitance)
: 500 MΩ min.
Insulation resistance
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max(HMK), 5%max(QMK, SMK, XMK).
: 10MΩμF or 500MΩ, whichever is smaller.
According to JIS 5101-1.
Preconditioning
Class 1
Class 2
Voltage treatment
None
(Rated voltage are applied for 1 hour at 40℃) Note 2
Temperature
Humidity
40±2℃
40±2℃
Test Methods and
Remarks
90 to 95%RH
90 to 95%RH
Duration
500+24/-0 hrs
Rated voltage
500+24/-0 hrs
Rated voltage
Applied voltage
Charge/discharge
current
50mA max.
50mA max.
Recovery
6 to 24 hrs (Standard condition) Note 3
24±2 hrs(Standard condition) Note 3
16. High Temperature Loading
Appearance
: No abnormality
Capacitance change
: Within ±7.5% or ±0.75pF, whichever is larger.(HMK)
: C<30pF:Q≧100+10C/3
Temperature Compensating(Class1)
Q
C≧30pF:Q≧200 (C:Nominal capacitance)
: 500 MΩ min.
Insulation resistance
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
High Permittivity (Class2)
: 7%max(HMK), 5%max(QMK, SMK, XMK).
: 50MΩμF or 1000MΩ, whichever is smaller.
According to JIS 5101-1.
Class 1
None
Class 2
Voltage treatment Note 2
Preconditioning
Temperature
Duration
Maximum operating temperature
1000+48/-0 hrs
Maximum operating temperature
1000+48/-0 hrs
Test Methods and
Remarks
Rated voltage×2(HMK), Rated voltage×1.5(QMK),
Rated voltage×1.2(SMK,XMK)
Applied voltage
Rated voltage×2(HMK)
50mA max.
Charge/discharge
current
50mA max.
Recovery
6 to 24hr (Standard condition) Note 3
24±2 hrs (Standard condition) Note 3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150+0/-10℃ for an hour and kept at
for 24±2hours.
room temperature
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the
test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under
the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E09R01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations (Design of Land-patterns)
1. When capacitors are mounted on PCBs, the amount of solder used (size of fillet) can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
(1)Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
(2)When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations (Capacitor layout on PCBs)
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes (PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.). For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations (Design of Land-patterns)
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
(1)Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
Land pattern
(unit: mm)
Solder-resist
Wave-soldering
Chip capacitor
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
C
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
B
A
B
Chip capacitor
W
L
Technical
Reflow-soldering
Type 021
considerations
042
0.4
0.2
063
0.6
0.3
105
1.0
0.5
107
1.6
212
2.0
316
3.2
325
3.2
432
4.5
3.2
L
0.25
Size
W
0.125
0.8
1.25
1.6
2.5
A
B
C
0.095~0.135 0.15~0.25 0.20~0.30 0.45~0.55
0.085~0.125 0.10~0.20 0.20~0.30 0.40~0.50
0.110~0.150 0.15~0.30 0.25~0.40 0.45~0.55
0.6~0.8
0.6~0.8
0.6~0.8
0.8~1.2
0.8~1.2
0.9~1.6
1.8~2.5
1.0~1.5
1.2~2.0
1.8~2.5
1.0~1.5
1.8~3.2
2.5~3.5
1.5~1.8
2.3~3.5
Note:Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering
(unit: mm)
Type
105
0.52
107
0.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
B
C
0.18~0.22
0.2~0.25
0.9~1.1
0.25~0.3
0.3~0.4
1.5~1.7
0.5~0.7
0.4~0.5
1.9~2.1
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
(2)Examples of good and bad solder application
Item
Not recommended
Recommended
Solder-resist
Lead wire of component
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A>B=C>D>E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
(1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
(2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
Technical
considerations
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
(2)The recommended amount of adhesives is as follows;
[Recommended condition]
Amount adhesive
After capacitor are bonded
a
a
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
b
Adhesives shall not contact land
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
(1)Flux used shall be less than or equal to 0.1 wt%( in Cl equivalent) of halogenated content. Flux having a strong acidity content shall
not be applied.
(2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
(3)When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance(Chlorine, etc.) content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
◆Soldering
・ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
・ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
・ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
130℃.
・ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
[Reflow soldering]
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
300
Peak
260℃ Max.
Within 10sec.
Preheating
230℃
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
1/2T~1/3T
Capacitor
PC board
Caution
Solder
T
①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible. soldering for 2 times.
[Wave soldering]
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
300
soldering】
300
Peak
230~250℃
Within 3sec.
260℃ Max.
Within 10sec.
Preheating
120sec. Min.
120sec. Min.
200
200
100
0
Slow
Slow cooling
Preheating
150℃
cooling
100
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.
[Hand soldering]
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
400
soldering】
400
400
300
200
100
0
Peak
Peak
280℃ Max.
Within 3sec.
230~280℃
Within 3sec.
350℃ Max.
Within 3sec.
300
300
⊿T
Slow cooling
200
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
100
Preheating
60sec. Min.
0
60sec. Min.
60sec. Min.
0
⊿T
⊿T
316type or less
⊿T≦150℃
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors. soldering for 1 times.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. (e.g. to remove soldering flux or other materials from the production process.)
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions( insufficient or excessive cleaning) may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of
capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully
checked;
Technical
considerations
Ultrasonic output :
20 W/ℓ or les
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
Precautions
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Precautions
Be careful not to subject capacitors to excessive mechanical shocks.
(1)If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
(2)Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to
design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for
1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B(Safety Application Guide for fixed ceramic capacitors for use in electronic equipment)is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
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